PCB & Electronic Assembly Static & Contamination Control Solutions

Printed Circuit Board (PCB) & Electronic Assembly products require protection from the destructive effects of electrostatic discharge (ESD) and particle contamination which can seriously damage sensitive electronic components and assemblies. Simco-Ion's extensive line of products from point of use ionizing air guns to benchtop and overhead ionizing blowers and compact ionizers that fit inside of tools are designed to protect production processes such as PCB manufacturing and assembly, surface mount technology, device programming, medical device manufacturing and testing.

Protecting High-Volume Electronic Assembly Production

From smartphones and AI servers to industrial controls and automotive electronics, printed circuit boards and electronic assemblies are the foundation of modern manufacturing. In nearly every stage of production — from bare board fabrication to final test — the simple contact and separation of materials generate static charge. Left uncontrolled, that charge will: attract particles onto boards, trigger instant or latent electrostatic discharge (ESD) damage, and create electromagnetic interference (EMI) that can shut down automated lines.

Simco-Ion, Technology Group delivers advanced ESD protection and contamination control solutions — ionizing bars, blowers, guns/nozzles, instrumentation, and continuous Novx monitoring — engineered to keep PCB and electronics assembly lines running clean, compliant, and productive from prototype build through high-volume production.

Industry Challenges

Why Static Control Matters in PCB & Electronic Assembly

Static charge generated during PCB and electronic assembly can significantly affect productivity and yield, and the risks compound as components shrink and voltage tolerances tighten.

CONTAMINATION
RISKS

Electrostatic attraction pulls airborne particles onto boards and components, causing yield loss during fabrication and assembly

ELECTROSTATIC
DISCHARGE RISKS

Uncontrolled ESD causes instant or latent defects in components and packaged assemblies, often surfacing only after the product reaches the field

ESD-INDUCED
EMI RISKS

Discharges generate electromagnetic interference that can trigger microprocessor lockup and robotic malfunctions, leading to product flow interruptions and costly tool downtime

TIGHTENING VOLTAGE THRESHOLDS

As components shrink, general electronics assembly and test are moving toward ultra-low voltage thresholds, such as 35V and below, to guard against latent ESD failures

COMPLIANCE &
MONITORING PRESSURE

Industry 4.0 requires simultaneous detection, measurement, recording, and monitoring of electrostatic activity for traceability and process control

Key Application Areas

PCB & Electronic Assembly Applications We Support

PCB Fabrication (Hard & Flexible) – Static attracts particulates during board fab, degrading trace integrity and yield.
Solder Paste Application – Charged boards and stencils attract contamination that compromises paste deposition.
SMT Component Placement – Tape/reel construction and operation, plus tray loading/unloading, generate static that can damage ESD-sensitive components before placement.
Reflow or Wave Soldering – Static buildup on boards moving on conveyor transport can stress sensitive devices.
Through-Hole Component Insertion – Manual and automated insertion generates contact-and-separation charge on components and boards.
Conformal Coating – Charged surfaces attract particulates that create defects under the coating layer.
Inspection & Testing – Microscope stages and test fixtures/sockets are common points for latent ESD damage and static-induced test errors.
Final Connection & Enclosure Assembly – Ordinary air blow-off operations during final assembly can generate significant static charge on enclosures and cabling.
Burn-In – Extended exposure during burn-in increases the risk of cumulative ESD stress on components.
Quality Control & Packaging – Static cling and particle attraction during final QC and packaging can compromise finished product quality.

Industry Regulation

What Standards Govern Static Control in Electronics Assembly?

Electronics manufacturers are held to a growing set of ESD and contamination control standards — and as components shrink and voltage tolerances tighten, many programs are moving toward more stringent, harmonized requirements.

ANSI/ESD S20.20 – Global standard for developing, implementing, and maintaining an ESD control program across industries.
IEC 61340-5-1 – International standard for protection of electronic devices from electrostatic phenomena.
IPC J-STD-001 & IPC-A-610 – Industry-standard requirements for soldered electrical/electronic assemblies and acceptability of electronic assemblies, including ESD handling provisions.
MIL-PRF-38535 & MIL-PRF-55342 – Military performance specifications for microelectronics and passive components, still referenced in defense-adjacent electronics programs.
NFPA 77 – Recommended Practice on Static Electricity, addressing fire and explosion hazards from uncontrolled charge.
UL Standards (various) – Certification standards for ESD-safe materials and devices.
EOS/ESD Association Technology Roadmap – Outlines best practices and evolving standards for static risk management, including Industry 4.0 monitoring requirements.

For additional information on PCB & electronic assembly manufacturing solutions for static and contamination control, contact Sales Services.

Sales Services

+1 (510) 217-0460

Toll-Free

+1 (800) 367-2452

salesservices@simco-ion.com

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Benefits of Static Control

Higher Yield – Reduce electrostatic attraction of particles that cause defects during fabrication, assembly, and coating.
Fewer Latent Failures – Prevent instant and latent ESD damage that surfaces only after a device reaches the field.
Line Uptime – Minimize ESD-induced EMI that triggers microprocessor lockup and robotic malfunction.
Ultra-Low Voltage Control – Meet tightening voltage thresholds (35V and below) required as components continue to shrink.
Governance & Standards – Support compliance with ANSI/ESD S20.20, IEC 61340-5-1, and IPC protocols, with traceable contamination and ESD quality controls.
Smart Manufacturing Readiness – Novx closed-loop feedback and monitoring meet Industry 4.0 requirements for detection, measurement, recording, and reporting.

Our Solutions

Targeted Solutions for PCB & Electronic Assembly

Product Groups	Models (click on product models below)
Ionizing Blowers	Models 5842, 6832, 5832, 5941, 6422e
Ionizing Bars	Models 5645, 5710, 5711
Special Application	In-line fusION, fusION AA
Ionizing Air Guns & Nozzles	Top Gun, AirForce 6115, orION
Static Control Monitoring Systems	Novx 3352, Novx 3362, Novx 7000
Instrumentation	Fieldmeter 775, Fieldmeter FMX-004, 775PVS, CPM 280A