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Model 4903

 

       

 

The Ultimate Modular Photon Soft X-ray Bar

The Model 4903 Photon Bar Ionizer is designed to eliminate static charge in semiconductor and other ultra-clean manufacturing processes requiring fast discharge time, low swing voltages, and precision balance. It utilizes a soft X-ray source, a form of light, and does not require an air supply to deliver ionized molecules. 

  • Suitable for critical cleanliness control
  • Low voltage tube type
  • Maintenance-free
  • Alarm output signal

 

For additional information on the 4903 bar ionizer or other ionization solutions for static control and particle contamination control, contact Sales Services.

Sales Services: 

+1 (510) 217-0460

Toll-Free:

+1 (800) 367-2452

salesservices@simco-ion.com
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Specifications

Power Input Model 4903-CTRL Controller
Discharge <1.5 sec @ 12” (30.5 cm); ±1,000V to ±100V
Balance Inherently balanced 0V
Ion Emission Soft X-ray Technology
Cleanroom Class Zero Particle Generation
Dimension Front Bar: 1.4”W x 1.1”H x 11.8, 17.7, 23.6, 35.4, 47.2”L (3.6 x 2.7 x 30, 45, 60, 90, 120 cm)
Weight

Front Bar (lb/kg) (Length cm)
0.93/0.42 (30), 1.32/0.60 (45), 1.72/0.78 (60), 2.58/1.17 (90), 3.48/1.58 (120)
  • Interface Cables
  • Power Cables
  • X-ray Tube
  • Brackets
 

ANSI/ESDA SP3.5-2020 – Standard Practice for the Protection of Electrostatic Discharge Susceptible Items - Test Methods for Air Assist Bar Ionizers, Soft X-ray (Photon) Ionizers, Room Ionization Alternatives, and Non-Airflow Alpha Ionizers.

Please refer to all the applicable industry standards for comprehensive electrostatic charge management on our Industry Standards page.

BROCHURES

Markets

  • ULTRA-Clean Ionization for Semiconductor Front-end

Applications

  • Semiconductor (Confine/Narrow Space Target Ionization: Pick-and-place, Surface Mount (SMT) & In-tool install
  • Post-production: 5 kV ionizer for diffusion process, in-tool applications for inspection tools
  • Expanding into semiconductor front-end and back-end manufacturing as well wafer oxidation, exposure, etching, ion implant, glass, and wafer dryer, etc.