Simco-Ion, Technology Group delivers ADVANCED ESD PROTECTION; cutting-edge ionization and monitoring solutions tailored for semiconductor back-end in-tool and test applications in wafer-level and panel-level packaging. Our comprehensive portfolio includes bars, blowers, guns/nozzles, instrumentation, and continuous monitoring systems, all engineered with a commitment to advanced technology and exceptional sensitivity.

As wafer-to-wafer, die-to-wafer, die-to-die, and die-to-substrate interconnection technologies, such as hybrid bonding and through-silicon-via (TSV), drive the rapid transition of back-end semiconductor requirements to 5V and below, Simco-Ion, Technology Group ensures our ionization products not only meet but exceed performance demands. Featuring Novx closed-loop feedback control and an FMS interface, our solutions meet and exceed customers’ performance requirements with unmatched precision and reliability for next-generation packaging needs.