Static charge is generated throughout the semiconductor manufacturing process, caused primarily by the contact and separation of dissimilar materials. Static charge affects productivity and yield in three ways. Static charge electrostatically attracts (ESA) particles from the air causing potential yield loss on wafers and reticles. Electrostatic discharge (ESD) of voltages cause instant or latent defects on reticles, wafers, or packaged chips. Electrostatic discharges can also create electromagnetic interference (EMI), triggering microprocessor lockup and robotic malfunctions that lead to product flow interruptions and costly tool downtime. Our portfolio of static charge control solutions addresses all stages of wafer manufacturing and testing.
Learn how Simco-Ion can help reduce yield losses and improve product quality in your manufacturing facility by downloading the brochures below.